Semiconductor Packaging : Advanced Packaging

IEEE EPS Malaysia, in collaboration with NXP, hosted a technical talk at Monash University Malaysia. The sessions introduced 17 engineering students, and respective Lecturer to the world of semiconductor packaging. 

IEEE EPS Malaysia immediate past chair Dr. Eu Poh Leng captivated the audience with a deep dive into Advanced Packaging, wafer level packaging and panel level packaging, highlighting emerging technologies and innovation trends. The initiative connect student with real-world engineering, planting seed of interest in careers within the semiconductor industry.

The event also offer a networking session between students and potential employer in future job market.