Advanced Packaging Workshop Bangi Malaysia

On 15 October 2025, the IEEE Electronics Packaging Society (EPS) Malaysia Chapter held a successful Advanced Packaging Workshop at Bangi Resort Hotel, bringing together professionals and students for a day of deep technical learning and industry engagement.

Dr. Beth Keser,presented “Introduction to and Advances in 2.3D Fan-Out Wafer & Panel Level Packaging”, offering insights into the evolution and future direction of high-performance packaging technologies.

Dr. Lee Teck Kheng, who spoke on “Reliability Management”, emphasizing the importance of robust design and testing methodologies in ensuring product longevity and performance.

The event drew 53 participants from leading semiconductor companies such as NXP，onsemi, Infineon,Texas Instruments and many others. It also welcomed enthusiastic participation from students representing UM, UKM, and other Malaysian universities, creating a dynamic mix of experience and curiosity.

Throughout the day, attendees engaged in lively discussions, exchanged ideas, and explored the latest trends shaping the semiconductor packaging landscape. The workshop underscored IEEE EPS Malaysia’s commitment to bridging academia and industry, and to nurturing the next generation of packaging professionals.