Semiconductor Assembly : Conventional Packaging

IEEE EPS Malaysia and NXP Malaysia collaborated to deliver insightful technical talks at Monash University Malaysia, engaging 17 engineering students. EPS Vice Secretary Miss Pey Fang presented a technical talk on Conventional Packaging, offering foundational knowledge and industry perspectives. 

These sessions aimed to inspire students toward careers in semiconductor packaging and foster deeper understanding of evolving technologies. The initiative reflects IEEE EPS Malaysia’s commitment to nurturing future talent and bridging academia with industry.